Thermal compound application. |
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MartinW
Moderator in Command Joined: 31 Mar 2008 Location: United Kingdom Points: 26722 |
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Posted: 08 Jan 2010 at 1:44pm |
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Interesting article. Note that Innovative Cooling, the makers of IC Diamond, recommend the blob method to avoid voids under the compound.
I wonder how many people have voids under their compound?
The consequences of not using the blob method can be seen in the link. Multiple air pockets.
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MartinW
Moderator in Command Joined: 31 Mar 2008 Location: United Kingdom Points: 26722 |
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Soaranden
P1 Joined: 14 Feb 2009 Points: 627 |
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At the risk of an unintended pun, this should be a "sticky."
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Magic Man
Chief Pilot Joined: 02 Apr 2008 Location: South Wales Points: 5336 |
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I did a straight pea blob on my last but previously have also done a smaller blob first but then wiped it over with a skimmer of some kind (finger wrapped in clingfilm) to fill any voids first. If you go back to slot 1/slot a days then you had a large CPU module to clamp against so you just sort of spread it on over that - I actually quited like that design, the CPU simply plugging in to a slot, it was neat and safe feeling rather than the clamp method now. My Athlon was the worst though since it had no cap protection and clamping a HS down on there could easily break a corner off if not level... |
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MartinW
Moderator in Command Joined: 31 Mar 2008 Location: United Kingdom Points: 26722 |
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Interesting thing is though, that companies like Arctic Silver, still recommend the two straight line technique for their product, with quad cores. And according to Innovative Coolings experiments, when the two lines merge, air is trapped between.
Any way, I have some Diamond now so will use their technique.
One things for sure though, with a £70 Noctua to play with, I won't be lapping this one.
To be honest, I can't say it made a noticeable difference last time.
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vyc66
Check-In Staff Joined: 09 Jan 2018 Points: 1 |
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Recently I saw one very interesting thermal grease. Have you ever tried this one? I always hold in high value anything that is nano-tech or nano-material related. However in this case it is kinda overkill. Anybody has experience with these high-end materials? Is it worth it?
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MartinW
Moderator in Command Joined: 31 Mar 2008 Location: United Kingdom Points: 26722 |
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I'm surprised to see this 8 year old thread materialise.
I've not seen the TIM you mention before no. The only diamond paste I've come across is the paste by Innovation Cooling. I don't see any figures for this pastes thermal conductivity, but interesting. I tend to use Noctua NT-H1 these days. I used to discard it when it came with Noctua coolers but upon realising that it's a actually a very good performer it's become my go to paste. Thing to remember though is that there's usually only a very small difference in temp between the top pastes. one or two degrees usually. Liquid Metal on the other hand is far superior to conventional paste, much closer to solder in terms of thermal conductivity. For CPU delidding purposes though I use Thermal Grizzly Conductonaut. Best liquid metal TIM there is for delidding in my opinion. Knocked 17 degrees of my daughters 7600K and I've just used it when I delidded my 8700K. Still to install and test but expecting a 15-20 degree reduction in CPU temp, compared to Intel's dodgy Die/IHS interface. |
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